Invention Grant
- Patent Title: Coupling for heat transfer member
- Patent Title (中): 传热件联轴器
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Application No.: US10627714Application Date: 2003-07-28
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Publication No.: US06993917B2Publication Date: 2006-02-07
- Inventor: Reuven Unger , Dong Gon Hwang , Woo Suk Chung
- Applicant: Reuven Unger , Dong Gon Hwang , Woo Suk Chung
- Applicant Address: KR Seoul US OH Athens
- Assignee: LG Electronics Inc.,Sunpower, Inc.
- Current Assignee: LG Electronics Inc.,Sunpower, Inc.
- Current Assignee Address: KR Seoul US OH Athens
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: F25B9/14
- IPC: F25B9/14

Abstract:
A heat transfer member having an external heat transfer member including an insertion hole having an adaptor ring inserted thereinto, and at least one of a base blocking protrusion and a grove blocking protrusion formed on a predetermined portion of the surface of the base confronting the inserted adaptor ring inside the insertion groove, for increasing the coupling strength of the external radiating member and the adaptor ring and the transition member.
Public/Granted literature
- US20040088999A1 Coupling for heat transfer member Public/Granted day:2004-05-13
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