发明授权
- 专利标题： Capacitor interconnect design
- 专利标题（中）： 电容互连设计
-
申请号： US11046165申请日： 2005-01-28
-
公开(公告)号： US06967829B2公开(公告)日： 2005-11-22
- 发明人: Keith W. Seitz , Kenneth Talamine , Laurie O'Connor , Michael Streun , Wayne Glidden , Barry Muffoletto
- 申请人： Keith W. Seitz , Kenneth Talamine , Laurie O'Connor , Michael Streun , Wayne Glidden , Barry Muffoletto
- 申请人地址： US NY Clarence US NC Fuquay-Varina
- 专利权人： Greatbatch, Inc.,Wayne Glidden
- 当前专利权人： Greatbatch, Inc.,Wayne Glidden
- 当前专利权人地址： US NY Clarence US NC Fuquay-Varina
- 代理商 Michael F. Scalise
- 主分类号： A61N1/375
- IPC分类号： A61N1/375 ; H01G2/10 ; H01G4/38 ; H01G5/38 ; H01G9/008 ; H01G9/06 ; H01G9/08 ; H01G9/10 ; H01G9/14
摘要：
Structures for serially connecting at least two capacitors together are described. Serially connecting capacitors together provides device manufactures, such as those selling implantable medical devices, with broad flexibility in terms of both how many capacitors are incorporated in the device and what configuration the capacitor assembly will assume.
公开/授权文献
- US20050162810A1 Capacitor interconnect design 公开/授权日：2005-07-28
信息查询
IPC分类:
