发明授权
- 专利标题： Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof
- 专利标题（中）： 无卤阻燃绝缘环氧树脂组合物和包含由其形成的绝缘层的电路板
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申请号： US10214640申请日： 2002-08-09
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公开(公告)号： US06916539B2公开(公告)日： 2005-07-12
- 发明人: Nawalage Florence Cooray , Koji Tsukamoto , Takeshi Ishitsuka
- 申请人： Nawalage Florence Cooray , Koji Tsukamoto , Takeshi Ishitsuka
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP11-349042 19991208
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; C08K3/22 ; C08K5/521 ; C08L63/00 ; H05K1/03 ; H05K3/46 ; B32B27/38 ; C09K21/12
摘要：
A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
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