Invention Grant
- Patent Title: Bonding tool and wire bonder
- Patent Title (中): 焊接工具和焊线机
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Application No.: US10464354Application Date: 2003-06-18
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Publication No.: US06905058B2Publication Date: 2005-06-14
- Inventor: Farhad Farassat
- Applicant: Farhad Farassat
- Applicant Address: DE Ottobrunn
- Assignee: F&K Delvotec Bondtechnik GmbH
- Current Assignee: F&K Delvotec Bondtechnik GmbH
- Current Assignee Address: DE Ottobrunn
- Agency: Boyle Fredrickson Newholm Stein & Gratz S.C.
- Priority: EP02013543 20020618; EP02017859 20020808
- Main IPC: B23K20/10
- IPC: B23K20/10 ; B21F15/02 ; B23K20/00 ; H01L21/60 ; H01L21/607 ; B23K1/06
Abstract:
Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded connection.
Public/Granted literature
- US20040011848A1 Bonding tool and wire bonder Public/Granted day:2004-01-22
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