发明授权
- 专利标题： Method of making a compliant integrated circuit package
- 专利标题（中）： 制造兼容集成电路封装的方法
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申请号： US10430986申请日： 2003-05-07
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公开(公告)号： US06897090B2公开(公告)日： 2005-05-24
- 发明人: Thomas H. DiStefano , Konstantine Karavakis , Craig Mitchell , John W. Smith
- 申请人： Thomas H. DiStefano , Konstantine Karavakis , Craig Mitchell , John W. Smith
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/31 ; H01L21/44
摘要：
A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connecting the bond region of that lead to a plurality of terminals. One or more of the connecting regions in each such plural set are severed so as to leave less than all of the terminals associated with each such plural set connected to the contacts of the chip.
公开/授权文献
- US20030207499A1 Compliant integrated circuit package 公开/授权日：2003-11-06
信息查询
IPC分类:
