Invention Grant
- Patent Title: Environment exchange control for material on a wafer surface
- Patent Title (中): 晶圆表面材料的环境交换控制
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Application No.: US09563775Application Date: 2000-05-02
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Publication No.: US06844027B1Publication Date: 2005-01-18
- Inventor: Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
- Applicant: Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
- Applicant Address: NL
- Assignee: ASML Holding N.V.
- Current Assignee: ASML Holding N.V.
- Current Assignee Address: NL
- Agency: Blakely Sokoloff Taylor & Zafman
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/16 ; G03F7/20 ; G03F7/26 ; G03F7/38 ; H01L21/027 ; B05D3/12

Abstract:
Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
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