Invention Grant
- Patent Title: Wafer drying apparatus
- Patent Title (中): 晶圆烘干设备
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Application No.: US10183813Application Date: 2002-06-26
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Publication No.: US06757989B2Publication Date: 2004-07-06
- Inventor: Jeong-Yong Bae , Chang-Ro Yoon , Pyeng-Jae Park
- Applicant: Jeong-Yong Bae , Chang-Ro Yoon , Pyeng-Jae Park
- Priority: KR2001-87114 20011228
- Main IPC: F26B1300
- IPC: F26B1300
Abstract:
An apparatus for drying a semiconductor substrate includes a chamber having a processing bath and a cover, a liquid flow system for supplying a liquid flow into the processing bath so as to clean the substrate and for draining a liquid from the processing bath, a gas distributor for spraying a gas for drying the substrate, and decompression means for exhausting air in the chamber.
Public/Granted literature
- US20030121173A1 Wafer drying apparatus Public/Granted day:2003-07-03
Information query
