Invention Grant
- Patent Title: Dummy structures that protect circuit elements during polishing
- Patent Title (中): 在抛光期间保护电路元件的虚拟结构
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Application No.: US10165741Application Date: 2002-06-06
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Publication No.: US06700143B2Publication Date: 2004-03-02
- Inventor: Hsing Ti Tuan , Chung Wai Leung
- Applicant: Hsing Ti Tuan , Chung Wai Leung
- Main IPC: H01L31119
- IPC: H01L31119

Abstract:
Circuit elements (e.g. transistor gates) formed over a semiconductor substrate are protected by adjacent dummy structures during mechanical or chemical mechanical polishing of an overlying dielectric.
Public/Granted literature
- US20020151141A1 Dummy structures that protect circuit elements during polishing Public/Granted day:2002-10-17
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