Invention Grant
- Patent Title: Electroplating method
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Application No.: US09977588Application Date: 2001-10-13
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Publication No.: US06649038B2Publication Date: 2003-11-18
- Inventor: Robert D. Mikkola , Jeffrey M. Calvert , Denis Morrissey
- Applicant: Robert D. Mikkola , Jeffrey M. Calvert , Denis Morrissey
- Main IPC: C25D1716
- IPC: C25D1716
Abstract:
Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.
Public/Granted literature
- US20020074231A1 Electroplating method Public/Granted day:2002-06-20
Information query
