发明授权
- 专利标题： Flip-chip assembly for optically-pumped lasers
- 专利标题（中）： 用于光泵浦激光器的倒装芯片组件
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申请号： US09954825申请日： 2001-09-18
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公开(公告)号： US06647050B2公开(公告)日： 2003-11-11
- 发明人: Albert T. Yuen , Michael R. T. Tan , Dubravko Ivan Babic , Scott William Corzine
- 申请人： Albert T. Yuen , Michael R. T. Tan , Dubravko Ivan Babic , Scott William Corzine
- 主分类号： H01S500
- IPC分类号： H01S500
摘要：
A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.
公开/授权文献
- US20030053510A1 Flip-chip assembly for optically-pumped lasers 公开/授权日：2003-03-20
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