A semiconductor device comprises a semiconductor chip. The semiconductor chip has an internal active region, an external active region, and a plurality of electrodes for electrically connecting the internal active region and the external active region to outside thereof, respectively. The semiconductor device also comprises a boarding portion that carries the semiconductor chip, a plurality of external electrode terminals for electrical connection to an external device, a plurality of connecting wires each connecting the electrode of the semiconductor chip and the external electrode terminal; and a mold resin that seals the semiconductor chip, the boarding portion and the connecting wires. The electrodes are disposed around the internal active region, and the external active region is disposed outside the electrodes.