Invention Grant
- Patent Title: Semiconductor device using an SOI substrate
- Patent Title (中): 使用SOI衬底的半导体器件
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Application No.: US09370220Application Date: 1999-08-09
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Publication No.: US06586803B2Publication Date: 2003-07-01
- Inventor: Hideto Hidaka , Katsuhiro Suma , Takahiro Tsuruda
- Applicant: Hideto Hidaka , Katsuhiro Suma , Takahiro Tsuruda
- Priority: JP7-29732 19950217
- Main IPC: H01L2701
- IPC: H01L2701

Abstract:
A semiconductor device includes an SOI substrate, trench memory cells including trench capacitors formed in the SOI substrate and a mesa or trench isolation region for isolating the trench memory cells. As a result, the trench memory cells are isolated more completely and soft errors are reduced.
Public/Granted literature
- US20020047157A1 SEMICONDUCTOR DEVICE USING AN SOI SUBSTRATE Public/Granted day:2002-04-25
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