Invention Grant
US06550742B1 Thermal cooled vacuum form 失效
热冷真空形式

  • Patent Title: Thermal cooled vacuum form
  • Patent Title (中): 热冷真空形式
  • Application No.: US09580049
    Application Date: 2000-05-27
  • Publication No.: US06550742B1
    Publication Date: 2003-04-22
  • Inventor: David M. Wahl
  • Applicant: David M. Wahl
  • Main IPC: B29C5110
  • IPC: B29C5110
Thermal cooled vacuum form
Abstract:
A method for preparing a mold form includes forming a mold blank having a surface corresponding to the surface of the article desired and enclosing the mold blank in an open ended enclosure. A thin layer of polymer resin, preferably polyurea is sprayed on the surface of the mold blank and allowed to cure. Heat transfer tubing is inserted over the resin layer. A mixture of metallic pellets and epoxy are inserted over the heat transfer tubing and then another layer of resin is sprayed over the mixture. After the resin has cured, the mold blank is removed to expose the mold form having an outer surface of polyurea.
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