Invention Grant
- Patent Title: Organometallic complex
- Patent Title (中): 有机金属络合物
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Application No.: US09989768Application Date: 2001-11-20
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Publication No.: US06458833B1Publication Date: 2002-10-01
- Inventor: Kuang-Lieh Lu , Jih-Ru Hwu , Shwu-Chen Tsay , Sheng-Fa Yu , Jui-Te Hung , Jiann-Jyh Huang
- Applicant: Kuang-Lieh Lu , Jih-Ru Hwu , Shwu-Chen Tsay , Sheng-Fa Yu , Jui-Te Hung , Jiann-Jyh Huang
- Main IPC: A61K3324
- IPC: A61K3324

Abstract:
A metal complex and its use for binding or cleaving a nucleic acid. The metal complex has the formula: M is Pt, Pd, Ni, Co, or Cu; X is aryl, heteroaryl, cyclyl, or heterocyclyl; Y is halogen, tosylate, mesylate, triflate, pyrophosphate, or carboxylate; each of A1 and A2, independently, is N or C; each of A3 and A4, independently, is N, S, or 0, wherein A1, A2, A3, and A4 taken together have one positive charge; and each of R1 and R2, independently, is alkyl, aryl, heteroaryl, alkoxyl, aryloxyl, heteroaryloxyl, alkoxylcarbonyl, aryloxylcarbonyl, or heteroaryloxylcarbonyl.
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