Invention Grant
- Patent Title: Capacitively coupled DTMOS on SOI
- Patent Title (中): 在SOI上电容耦合DTMOS
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Application No.: US09605920Application Date: 2000-06-28
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Publication No.: US06420767B1Publication Date: 2002-07-16
- Inventor: Srinath Krishnan , John C. Holst , Bin Yu
- Applicant: Srinath Krishnan , John C. Holst , Bin Yu
- Main IPC: H01L2976
- IPC: H01L2976

Abstract:
A transistor structure is provided comprising a source region having a N+ source region and a N− lightly doped source region. The structure also comprises a drain region having a N+ drain region and a N− lightly doped drain region. A P++ heavily doped region is provided. The P++ region resides alongside at least a portion of at least one of the N− lightly doped source region and N− lightly doped drain region. A P+ body region resides below a gate of the device and between the source and drain regions. The P+⇄ heavily doped region provides a capacitive coupling between a body region and the gate of the device and form a capacitive voltage divider with the junction capacitance of the device.
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