A modular frame assembly and modules are provided. The modular frame assembly includes a motherboard, module connectors and an opening in the motherboard for allowing direct connection of first and second modules. The first modules have plugs that extend through the plane of the motherboard, allowing the size of the opening to be minimized. The second modules have a wide external connector portion that allows for high density interconnection on the rear of the frame. Each of the modules may be provided with a plurality of connectors.