Invention Grant
- Patent Title: Developer for photosensitive polyimide resin composition
- Patent Title (中): 光敏聚酰亚胺树脂组合物显影剂
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Application No.: US09183341Application Date: 1998-10-30
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Publication No.: US06403289B1Publication Date: 2002-06-11
- Inventor: Akira Tanaka , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi
- Applicant: Akira Tanaka , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi
- Priority: JP9-316139 19971031
- Main IPC: G03F732
- IPC: G03F732

Abstract:
The invention relates to a developer for photosensitive polyimide resin compositions, comprising an alkaline aqueous solution containing a basic compound (A) represented by a formula (1): wherein X+ is N+ or P+, R is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 10 ring forming carbon atoms, Y− is a monovalent anion, m is 0 or 1, n is 3 or 4, and m+n is 4, with the proviso that when m is 0, n is 4, and R is an alkyl group, the total number of carbon atoms of 4 alkyl groups is at least 13, or when m is 1, n is 3, and R is an alkyl group, the total number of carbon atoms of 3 alkyl groups is at least 6.
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