发明授权
- 专利标题： Apparatus and method for laser fusion bonding
- 专利标题（中）： 用于激光熔接的装置和方法
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申请号： US09492292申请日： 2000-01-27
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公开(公告)号： US06373025B1公开(公告)日： 2002-04-16
- 发明人: Kiyoshi Takeuchi , Shirou Takigawa , Takahiko Kondou , Takashi Hosoya , Yasukuni Iwasaki , Koichi Abe
- 申请人： Kiyoshi Takeuchi , Shirou Takigawa , Takahiko Kondou , Takashi Hosoya , Yasukuni Iwasaki , Koichi Abe
- 优先权： JP11-026645 19990203
- 主分类号： B23K2620
- IPC分类号： B23K2620
摘要：
A laser fusion bonding apparatus includes a laser beam irradiation unit for emitting a laser beam with which portions of two works which are in contact with or close to each other are irradiated, and thereby fusion bonded. The laser beam is a substantially-parallel laser beam.
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