发明授权
- 专利标题： Method of making connection component
- 专利标题（中）： 连接组件的制作方法
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申请号： US09200100申请日： 1998-11-25
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公开(公告)号： US06357112B1公开(公告)日： 2002-03-19
- 发明人: Thomas H. DiStefano , Joseph Fjelstad , Belgacem Haba , Owais Jamil , Konstantine Karavakis , David Light , John W. Smith
- 申请人： Thomas H. DiStefano , Joseph Fjelstad , Belgacem Haba , Owais Jamil , Konstantine Karavakis , David Light , John W. Smith
- 主分类号： H01R906
- IPC分类号： H01R906
摘要：
A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.
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