A method of fabricating a semiconductor wafer includes the step of fabricating a number of die on the wafer. The method also includes the step of fabricating a memory device on the wafer. The method further includes the step of testing the number of die with a die testing apparatus so as to obtain test data associated with the number of die. In addition, the method includes the step of storing the test data obtained during the testing step in the memory device. Moreover, the method includes the step of retrieving the test data from the memory device. Yet further, the method includes the step of operating a packaging apparatus so as to package a first die of the number of die based on the test data. A semiconductor wafer is also disclosed.