发明授权
US6165912A Electroless metal deposition of electronic components in an enclosable
vessel
失效
将电子部件无电镀金属沉积在可封闭的容器中
- 专利标题： Electroless metal deposition of electronic components in an enclosable vessel
- 专利标题（中）： 将电子部件无电镀金属沉积在可封闭的容器中
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申请号： US395398申请日： 1999-09-14
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公开(公告)号： US6165912A公开(公告)日： 2000-12-26
- 发明人: Christopher F. McConnell , Steven Verhaverbeke
- 申请人： Christopher F. McConnell , Steven Verhaverbeke
- 申请人地址： DE Wilmington
- 专利权人： CFMT, Inc.
- 当前专利权人： CFMT, Inc.
- 当前专利权人地址： DE Wilmington
- 主分类号： C23C18/28
- IPC分类号： C23C18/28 ; C23C18/16 ; C23C18/31 ; H01L21/288 ; H05K3/18 ; H01L21/31 ; B05D1/18 ; B05D3/10
摘要：
The present invention provides methods of electrolessly depositing metal onto the surfaces of electronic components using an enclosable single vessel. The methods of the present invention include contacting the electronic components with an activation solution followed by contacting the electronic components with a metal deposition solution. In a preferred embodiment of the present invention, the oxygen levels in the activation solution and metal deposition solution are controlled in a manner for improved processing results. In another preferred embodiment of the present invention, the activation and metal deposition solutions are used one time without reuse.
公开/授权文献
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