发明授权
- 专利标题： Method of producing an electronic component, in particular a surface acoustic wave component
- 专利标题（中）： 电子部件的制造方法，特别是表面声波部件
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申请号： US103160申请日： 1998-06-22
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公开(公告)号： US6136175A公开(公告)日： 2000-10-24
- 发明人: Alois Stelzl , Hans Kruger , Wolfgang Pahl , Jurgen Machui
- 申请人： Alois Stelzl , Hans Kruger , Wolfgang Pahl , Jurgen Machui
- 申请人地址： DEX Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DEX Munich
- 主分类号： H03H9/25
- IPC分类号： H03H9/25 ; H03H3/08 ; H03H9/02 ; H03H9/05 ; C25D5/48 ; B05D5/12 ; C23C14/14 ; H04R17/00
摘要：
The electronic component, specifically a SAW component with conductive structures disposed on a substrate is encapsulated for protection against environmental influences. The electrically conductive structures are sealed with a gas diffusion-constricting protective layer formed with an electrochemical or ion bombardment process.
公开/授权文献
- USD431739S Furniture leg 公开/授权日：2000-10-10
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