发明授权
US6127264A Integrated circuit having conductors of enhanced cross-sectional area
有权
集成电路具有增强的横截面积的导体
- 专利标题： Integrated circuit having conductors of enhanced cross-sectional area
- 专利标题（中）： 集成电路具有增强的横截面积的导体
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申请号： US166463申请日： 1998-10-05
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公开(公告)号： US6127264A公开(公告)日： 2000-10-03
- 发明人: Basab Bandyopadhyay , H. Jim Fulford, Jr. , Robert Dawson , Fred N. Hause , Mark W. Michael , William S. Brennan
- 申请人： Basab Bandyopadhyay , H. Jim Fulford, Jr. , Robert Dawson , Fred N. Hause , Mark W. Michael , William S. Brennan
- 申请人地址： CA Sunnyvale
- 专利权人： Advanced Micro Devices, Inc.
- 当前专利权人： Advanced Micro Devices, Inc.
- 当前专利权人地址： CA Sunnyvale
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L23/528 ; H01L21/4763 ; H01L21/44 ; H01L23/48
摘要：
A interconnect structure is provided having a conductor with enhanced thickness. The conductor includes an upper portion and a lower portion, wherein the lower portion geometry is sufficient to increase the current-carrying capacity beyond that provided by the upper portion. The lower portion is formed by filling a trench within an upper dielectric region, and the upper portion is formed by selectively removing a conductive material from the upper dielectric surface except for regions directly above the lower portion. The upper and lower portions thereby form a conductor of enhanced cross-section which can be produced by modifying a via-etch mask, rather than having to reconfigure and/or move interconnect features formed by a metal mask.
公开/授权文献
- US5517570A Sound reproducing array processor system 公开/授权日：1996-05-14
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