A probe method is disclosed which inspects the electrical characteristics of an object to be inspected (wafer W) by bringing the electrodes of the object to be inspected placed on a main chuck and probes of a probe card into contact with each other. The main chuck is movable in the X, Y, Z, and .theta. directions and heated to a predetermined inspection temperature. The main chuck retreats to a position separated from the inspection position during high-temperature inspection. The time (retreat time) during which the main chuck stays retreated is calculated by a retreat time calculating mechanism. A preheat execute determination mechanism determines whether the probe card and probes are to be preheated on the basis of the retreat time. When it is determined that preheating is necessary, a preheat time calculation mechanism calculates the preheat execute time. Preheating is executed during the preheat execute time determined by a preheat end determination mechanism, and misalignment of the probes is corrected.