The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.