发明授权
- 专利标题： Semiconductor device and method for manufacturing semiconductor device
- 专利标题（中）： 半导体装置及半导体装置的制造方法
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申请号： US962395申请日： 1997-10-31
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公开(公告)号： US5891758A公开(公告)日： 1999-04-06
- 发明人: Toshiyuki Honda , Akihiro Oku , Takanori Watanabe , Kazuto Tsuji , Yoshiyuki Yoneda
- 申请人： Toshiyuki Honda , Akihiro Oku , Takanori Watanabe , Kazuto Tsuji , Yoshiyuki Yoneda
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited, Ltd.
- 当前专利权人： Fujitsu Limited, Ltd.
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX9-152678 19970610
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/56 ; H01L21/68 ; H01L23/31 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method of manufacturing a semiconductor device includes the steps of: mounting a semiconductor chip on a holding board having electrode accommodation recesses formed thereon, and mounting electrode members to the electrode accommodation recesses, the electrode members being formed separately from the semiconductor element; electrically connecting electrode pads formed on the semiconductor chip with the electrode members; forming a resin package for sealing the semiconductor chip on the holding board by using a die, the holding board serving as a part of the die; and separating the resin package including the electrode members from the holding board. A semiconductor device includes: a semiconductor chip; a resin package for sealing the semiconductor chip; electrode members which are embedded in and held by the resin package and which are partly exposed from a mounting surface so as to form external connection terminals; and connecting parts electrically connecting electrode pads on the semiconductor chip with the electrode members.
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