Invention Grant
- Patent Title: Metal ball grid array package with improved thermal conductivity
- Patent Title (中): 金属球栅阵列封装具有改善的导热性
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Application No.: US277387Application Date: 1994-07-19
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Publication No.: US5629835APublication Date: 1997-05-13
- Inventor: Deepak Mahulikar , Paul R. Hoffman , Jeffrey S. Braden
- Applicant: Deepak Mahulikar , Paul R. Hoffman , Jeffrey S. Braden
- Applicant Address: CA Manteca
- Assignee: Olin Corporation
- Current Assignee: Olin Corporation
- Current Assignee Address: CA Manteca
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/48 ; H01L23/13 ; H01L23/14 ; H01L23/24 ; H01L23/498 ; H01L23/50 ; H01L25/065 ; H01L25/10 ; H05K7/20 ; H01L23/34
Abstract:
There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.
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