发明授权
- 专利标题： Method for improving electromagnetic shielding performance of composite materials by electroplating
- 专利标题（中）： 通过电镀提高复合材料电磁屏蔽性能的方法
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申请号： US105316申请日： 1993-07-30
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公开(公告)号： US5413694A公开(公告)日： 1995-05-09
- 发明人: David S. Dixon , Michael D. Obara , James V. Masi , William G. Bradley
- 申请人： David S. Dixon , Michael D. Obara , James V. Masi , William G. Bradley
- 申请人地址： DC Washington
- 专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人地址： DC Washington
- 主分类号： H01B1/20
- IPC分类号： H01B1/20 ; H01B1/22 ; H05K9/00 ; C25D5/24 ; C25D5/00
摘要：
A method of improving the electromagnetic (EM) shielding performance of a mposite material is provided. The composite material has conductive and semi-conductive filler particles suspended in a non-conductive resin. The filler particles can be up to 40 weight percent of the composite material. The composite material is electroplated with a conductive material onto a portion of its surface to improve the electrical connection between the conductive material and a portion of the filler particles. EM shielding performance can be further enhanced by injecting an exponentially decaying electromagnetic pulse through the composite material that has been electroplated.
公开/授权文献
- USD432549S Outer surface of a side console 公开/授权日：2000-10-24
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