Invention Grant
US5275975A Method of making a relatively flat semiconductor package having a
semiconductor chip encapsulated in molded material
失效
制造具有封装在模制材料中的半导体芯片的相对平坦的半导体封装的方法
- Patent Title: Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material
- Patent Title (中): 制造具有封装在模制材料中的半导体芯片的相对平坦的半导体封装的方法
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Application No.: US907258Application Date: 1992-07-01
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Publication No.: US5275975APublication Date: 1994-01-04
- Inventor: Daniel A. Baudouin , Ernest J. Russell
- Applicant: Daniel A. Baudouin , Ernest J. Russell
- Applicant Address: TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: TX Dallas
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K3/30 ; H01L21/60
Abstract:
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.
Public/Granted literature
- US5834388A Ceramic fibers in the system silicon-boron-nitrogen-carbon Public/Granted day:1998-11-10
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