Invention Grant
- Patent Title: Application of laminated interconnect media between a laminated power source and semiconductor devices
- Patent Title (中): 层压互连介质在层压电源和半导体器件之间的应用
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Application No.: US782570Application Date: 1991-10-25
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Publication No.: US5187564APublication Date: 1993-02-16
- Inventor: Joseph H. McCain
- Applicant: Joseph H. McCain
- Applicant Address: TX Carrollton
- Assignee: SGS-Thomson Microelectronics, Inc.
- Current Assignee: SGS-Thomson Microelectronics, Inc.
- Current Assignee Address: TX Carrollton
- Main IPC: H01M2/30
- IPC: H01M2/30 ; G11C5/14 ; H01L23/495 ; H01L23/58 ; H01M2/10 ; H01M2/20 ; H01M4/60 ; H01M6/18 ; H01M10/04
Abstract:
A flat geometry interconnect media connects the electrodes of a laminated power source in electrical contact with positive and negative power input terminals on a planar substrate. The interconnect media is in the form of a flexible, laminated strip having a central conductive lamina sandwiched between a pair of insulation laminae. The flexible, laminated interconnect media is folded about the anode and cathode of the laminated power source for presenting positive and negative battery terminals in substantially coplanar relation for electrical contact with substrate lands or metallization deposits situated on one side of a printed circuit board. The laminated battery supplies backup operating power to integrated circuit devices such as static random access memories.
Public/Granted literature
- US5923513A Active snubber device for power modules Public/Granted day:1999-07-13
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