Invention Grant
US5187564A Application of laminated interconnect media between a laminated power source and semiconductor devices 失效
层压互连介质在层压电源和半导体器件之间的应用

Application of laminated interconnect media between a laminated power
source and semiconductor devices
Abstract:
A flat geometry interconnect media connects the electrodes of a laminated power source in electrical contact with positive and negative power input terminals on a planar substrate. The interconnect media is in the form of a flexible, laminated strip having a central conductive lamina sandwiched between a pair of insulation laminae. The flexible, laminated interconnect media is folded about the anode and cathode of the laminated power source for presenting positive and negative battery terminals in substantially coplanar relation for electrical contact with substrate lands or metallization deposits situated on one side of a printed circuit board. The laminated battery supplies backup operating power to integrated circuit devices such as static random access memories.
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