Invention Grant
- Patent Title: Heat curable blends of silicone polymide and epoxy resin
- Patent Title (中): 硅氧烷聚酰胺和环氧树脂的热固化共混物
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Application No.: US836493Application Date: 1992-02-18
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Publication No.: US5169911APublication Date: 1992-12-08
- Inventor: John H. Lupinski , Thomas B. Gorczyca
- Applicant: John H. Lupinski , Thomas B. Gorczyca
- Applicant Address: NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: NY Schenectady
- Main IPC: C08G59/00
- IPC: C08G59/00 ; C08G59/68 ; C08L63/00 ; C08L79/08 ; C08L83/10 ; H01B3/30 ; H01B3/40 ; H01B3/46 ; H01L23/498 ; H01L23/532
Abstract:
Heat curable dielectric compositions are provided comprising blends of silicone polyimide and epoxy resin and an effective amount of an arylonium salt such as a diaryliodoniumhexafluoroantimonate in combination with a free radical generating aromatic compound as a cocatalyst.
Public/Granted literature
- US5808437A Method for compensation of periodic shaking forces in an electrical rotating field machine Public/Granted day:1998-09-15
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