发明授权
US5135891A Method for forming film of uniform thickness on semiconductor substrate
having concave portion
失效
在具有凹部的半导体基板上形成均匀厚度的膜的方法
- 专利标题： Method for forming film of uniform thickness on semiconductor substrate having concave portion
- 专利标题（中）： 在具有凹部的半导体基板上形成均匀厚度的膜的方法
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申请号： US297623申请日： 1989-01-17
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公开(公告)号： US5135891A公开(公告)日： 1992-08-04
- 发明人: Masahiko Ikeno , Hideo Saeki , Hiroshi Kawashima
- 申请人： Masahiko Ikeno , Hideo Saeki , Hiroshi Kawashima
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX63-9957 19880119; JPX63-245779 19880929
- 主分类号： H01L21/312
- IPC分类号： H01L21/312 ; H01L27/148 ; H01L31/0216
摘要：
A photoresist of sufficient thickness to fill a scribe line is applied on an entire substrate. Then, the photoresist is exposed through a photomask having a pattern corresponding to the scribe line and is thereafter developed. A photosensitized gelatin is applied by spin-coating on the flat substrate obtained in this process, patterned, and then dyed, to obtain a color filter array.
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