Invention Grant
- Patent Title: Method for providing adhesion to a metal surface
- Patent Title (中): 提供对金属表面的附着力的方法
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Application No.: US461922Application Date: 1990-01-08
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Publication No.: US5089063APublication Date: 1992-02-18
- Inventor: Larry A. Harrah , Ronald E. Allred , Kennard V. Wilson, Jr.
- Applicant: Larry A. Harrah , Ronald E. Allred , Kennard V. Wilson, Jr.
- Applicant Address: CA Costa Mesa
- Assignee: PDA Engineering, Inc.
- Current Assignee: PDA Engineering, Inc.
- Current Assignee Address: CA Costa Mesa
- Main IPC: B05D3/02
- IPC: B05D3/02 ; B05D3/04 ; B05D3/06 ; B05D3/10 ; C09J5/02 ; C23C26/00
Abstract:
A process for treating metal surfaces to obtain improved susceptibility to bonding with adhesive compositions is disclosed. A metal surface is oxidized with a halogen to form a monolayer of halide ions on the surface. The halide ions are then exchanged with azide ions to form an azide monolayer on the metal surface. Upon contact of the treated surface with an adhesive composition, the azide layer may be thermally or photochemically decomposed to form active nitrene species, which react to bond the adhesive composition to the metal surface.
Public/Granted literature
- US5516619A Conductive composite particles and processes for the preparation thereof Public/Granted day:1996-05-14
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