A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A--B--A' type block copolymer elastomer.