Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US26254Application Date: 1987-03-16
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Publication No.: US4860086APublication Date: 1989-08-22
- Inventor: Tohru Nakamura , Masahiko Ogirima , Kazuo Nakazato , Takao Miyazaki , Naoki Yamamoto , Minoru Nagata , Shojiro Sugaki, deceased
- Applicant: Tohru Nakamura , Masahiko Ogirima , Kazuo Nakazato , Takao Miyazaki , Naoki Yamamoto , Minoru Nagata , Shojiro Sugaki, deceased
- Applicant Address: JPX Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JPX Tokyo
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L23/532
Abstract:
A semiconductor device is constructed so that an insulation film is provided in regions other than a protruding portion of a substrate. A polycrystalline silicon layer and a metal silicide layer are formed over said insulation film to provide a multi-layer structure, and a take-out portion for at least one of the emitter, base, and collector members of a bipolar transistor provided in the mesa region is constituted by a film of this multi-layer structure. By virtue of the use of metal silicide together with the polycrystalline silicon, a very low resistance is achieved which enhances the device's operating speed. Further, the metal silicide is separated from the protruding portion of the substrate by a portion of the polycrystalline silicon to provide a smooth interface with the substrate. This smooth interface significantly reduces crystal defects in the single crystal substrate.
Public/Granted literature
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