发明授权
- 专利标题: Process for forming a pressure sensitive adhesive on a substrate
- 专利标题(中): 在基材上形成压敏粘合剂的方法
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申请号: US024211申请日: 1987-03-10
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公开(公告)号: US4735829A公开(公告)日: 1988-04-05
- 发明人: Toshifumi Hirose , Katsuhiko Isayama
- 申请人: Toshifumi Hirose , Katsuhiko Isayama
- 申请人地址: JPX Osaka
- 专利权人: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Osaka
- 优先权: JPX59-183097 19840831
- 主分类号: C08L71/00
- IPC分类号: C08L71/00 ; C08G65/332 ; C08G65/336 ; C08L7/00 ; C08L21/00 ; C08L23/00 ; C08L33/00 ; C08L33/02 ; C08L51/00 ; C08L51/02 ; C08L71/02 ; C08L77/00 ; C08L101/00 ; C09J7/02 ; C09J11/06 ; C09J133/04 ; C09J133/08 ; C09J171/00 ; C09J171/02 ; C09J183/10 ; C09J201/00 ; B05D3/02
摘要:
A process for preparing a pressure sensitive adhesive comprising:(A) an organic polymer having in its molecule at least one reactive silicon-containing group represented by the formula (I): ##STR1## wherein R.sup.2 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or a triorganosiloxy group having the formula (II):(R').sub.3 SiO-- (II)in which R' is a monovalent hydrocarbon group having 1 to 20 carbon atoms and may be the same or different, X is hydroxyl group or a hydrolyzable group, and may be the same or different when 2 or more X groups are attached, a is 0 or an integer of 1 to 3, b is 0, 1 or 2, and m is 0 or an integer of 1 to 18, and(B) 0.1 to 20 parts by weight of, per 100 parts by weight of the organic polymer, at least one curing catalyst selected from the group consisting of an organic aluminium and an organic zirconium. The composition has excellent heat resistance and releasability from substrates, e.g. a release paper coated with a silicone release agent.
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