Invention Grant
- Patent Title: Ferromagnetic high speed sputtering apparatus
- Patent Title (中): 铁磁高速溅射装置
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Application No.: US401079Application Date: 1982-07-23
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Publication No.: US4412907APublication Date: 1983-11-01
- Inventor: Akio Ito , Kyuzo Nakamura , Yoshifumi Ota , Taiki Yamada
- Applicant: Akio Ito , Kyuzo Nakamura , Yoshifumi Ota , Taiki Yamada
- Applicant Address: JPX Kanagawa
- Assignee: Nihon Shinku Gijutsu Kabushiki Kaisha
- Current Assignee: Nihon Shinku Gijutsu Kabushiki Kaisha
- Current Assignee Address: JPX Kanagawa
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C15/00
Abstract:
A ferromagnetic, high speed, sputtering apparatus is provided which comprises a vacuum chamber and a target of ferromagnetic material. The target comprises at least two segments which are positioned adjacent to one another and have a gap therebetween. This gap has at least a portion of which that does not extend in the direction of the thickness of the target. A substrate in the vacuum chamber is positioned facing one side of the target. Also, magnetic field generating means is positioned on the other side of the target so that the magnetic field therefrom leaks through the gap.
Public/Granted literature
- US5513630A Powder dispenser Public/Granted day:1996-05-07
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