发明授权
- 专利标题： Substrate separating machine and method
- 专利标题（中）： 基板分离机及方法
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申请号： US941181申请日： 1978-09-11
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公开(公告)号： US4235357A公开(公告)日： 1980-11-25
- 发明人: David H. Young
- 申请人： David H. Young
- 申请人地址： PA Ivyland
- 专利权人： MTI Systems Corporation
- 当前专利权人： MTI Systems Corporation
- 当前专利权人地址： PA Ivyland
- 主分类号： B26F3/00
- IPC分类号： B26F3/00 ; B28D5/00 ; H01L21/302
摘要：
A machine and method for subdividing into individual substrates a wafer which is prescored with a pattern of intersecting score lines defining the substrates. The wafer is progressively directed over a first wafer-engaging surface substantially paralleling one set of score lines, and this surface cooperates during a breaking operation to impart a localized force at a score line in the set. The wafer is halted during the breaking operation, after which the broken-off portion is directed over a second wafer-engaging surface substantially paralleling the other set of score lines. This second surface cooperates, during a substrate breaking operation, to apply a localized force adjacent a score line of the other set. The broken-off portion is halted during this latter breaking operation at which a substrate is separated from the broken-off portion of the wafer.
公开/授权文献
- US5850798A Cat-box liner 公开/授权日：1998-12-22
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