Invention Grant
US4188221A Photosensitive polyamide resin composition useful for making relief
printing plate
失效
用于制造凸版印刷版的感光性聚酰胺树脂组合物
- Patent Title: Photosensitive polyamide resin composition useful for making relief printing plate
- Patent Title (中): 用于制造凸版印刷版的感光性聚酰胺树脂组合物
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Application No.: US904168Application Date: 1978-05-08
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Publication No.: US4188221APublication Date: 1980-02-12
- Inventor: Masaru Nanpei , Toshiaki Fujimura , Hajime Kouda , Yoshihiro Kasho , Kuniomi Etoh
- Applicant: Masaru Nanpei , Toshiaki Fujimura , Hajime Kouda , Yoshihiro Kasho , Kuniomi Etoh
- Applicant Address: JPX
- Assignee: Toyo Boseki Kabushiki Kaisha
- Current Assignee: Toyo Boseki Kabushiki Kaisha
- Current Assignee Address: JPX
- Priority: JPX52-55744 19770514
- Main IPC: C08F2/00
- IPC: C08F2/00 ; C08F2/48 ; C08F283/00 ; C08F283/04 ; C08F290/00 ; C08F299/00 ; G03F7/032 ; G03F7/037 ; G03C1/68
Abstract:
Photosensitive polyamide resin composition which can be developed with water to give a relief printing plate having an excellent moisture resistance, comprising 30 to 90% by weight of a water-soluble polyamide having ammonium type nitrogen atoms and 5 to 70% by weight of a photopolymerizable unsaturated compound prepared by reacting (meth)acrylic acid (I) and a polyglycidyl ether of an aliphatic polyvalent alcohol (II) in an equivalent ratio of 0.5.ltoreq.(I)/(II).ltoreq.2.0, and 0.01 to 10% by weight of a photopolymerization initiator.
Public/Granted literature
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