Invention Grant
- Patent Title: Gun
- Patent Title (中): 枪
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Application No.: US558467Application Date: 1975-03-14
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Publication No.: US4008538APublication Date: 1977-02-22
- Inventor: Warren A. Center
- Applicant: Warren A. Center
- Assignee: Center Warren A
- Current Assignee: Center Warren A
- Main IPC: F41A21/28
- IPC: F41A21/28 ; F41A21/40 ; F41C21/00
Abstract:
This invention has to do with a gun and, more particularly, to a firearm having a rifled barrel which can be used effectively with shotgun shells.
Public/Granted literature
- US5055911A Semiconductor device package utilizing a solder flow prevention wall Public/Granted day:1991-10-08
Information query
