发明授权
US3633268A Method of producing one or more large integrated semiconductor circuits
失效
生产一个或多个更大的集成半导体电路的方法
- 专利标题： Method of producing one or more large integrated semiconductor circuits
- 专利标题（中）： 生产一个或多个更大的集成半导体电路的方法
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申请号： US3633268D申请日： 1969-06-02
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公开(公告)号： US3633268A公开(公告)日： 1972-01-11
- 发明人: ENGBERT REINER
- 申请人： TELEFUNKEN PATENT
- 专利权人： Telefunken Patentverwertungsgesellschaft Mbh
- 当前专利权人： Telefunken Patentverwertungsgesellschaft Mbh
- 优先权： DE1764426 1968-06-04
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/522 ; H01L27/118 ; B01J17/00 ; H01L7/00
摘要：
The disclosure relates to a method of producing one or more integrated semiconductor circuits in which the usable basic circuits on a semiconductor wafer are connected together and the useless basic circuits bypassed. For this, a conductive path mask is produced photographically from at least two individual masks one of which represents the conductive paths to a usable basic circuit and another of which represents the paths necessary to bypass a useless basic circuit.
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