Invention Application
- Patent Title: MASK BLANK
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Application No.: US18918951Application Date: 2024-10-17
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Publication No.: US20250044677A1Publication Date: 2025-02-06
- Inventor: Hiroaki SHISHIDO , Ryo OHKUBO , Osamu NOZAWA
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2019-050514 20190318
- Main IPC: G03F1/32
- IPC: G03F1/32

Abstract:
The present invention addresses the problem of providing a mask blank that makes it possible to further miniaturize a mask pattern or a hard mask pattern and improving the pattern quality, and to resolve this problem, a mask blank (100) has a structure in which a thin film (3) for pattern formation and a hard mask film (4) are laminated in this order on a transparent substrate (1), wherein the hard mask film (4) is configured so that a narrow spectrum of Si2p obtained by analysis by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of 103 eV or more, a maximum peak of a narrow spectrum of N1s obtained by analysis by X-ray photoelectron spectroscopy is equal to or less than a detection lower limit value, and the content ratio (atomic %) of silicon and oxygen is less than Si:O=1:2.
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