Invention Publication
- Patent Title: THINNER COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES USING SAID THINNER COMPOSITION
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Application No.: US18580370Application Date: 2022-07-25
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Publication No.: US20240361693A1Publication Date: 2024-10-31
- Inventor: Takumi OKADA , Ryosuke HOSHINO , Hideyuki SATO , Masayuki KATAGIRI , Shu SUZUKI , Masatoshi ECHIGO
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Priority: JP 21125387 2021.07.30
- International Application: PCT/JP2022/028578 2022.07.25
- Date entered country: 2024-01-18
- Main IPC: G03F7/105
- IPC: G03F7/105 ; G03F7/004 ; G03F7/16 ; H01L21/02 ; H01L21/027
Abstract:
A thinner composition includes: (B) a solvent containing: (B1) a compound represented by the following general formula (b-1): wherein R1 is an alkyl group having 1 to 10 carbon atoms. A method for manufacturing a semiconductor device includes applying the thinner composition to a substrate, before applying a photoresist film material or a photoresist underlayer film material to the substrate.
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