- 专利标题: SUPPORT GLASS SUBSTRATE, MULTI-LAYER BODY, METHOD FOR PRODUCING MULTI-LAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
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申请号: US18682636申请日: 2022-07-29
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公开(公告)号: US20240360027A1公开(公告)日: 2024-10-31
- 发明人: Miyako TAKEDA
- 申请人: NIPPON ELECTRIC GLASSS CO., LTD.
- 申请人地址: JP Shiga
- 专利权人: NIPPON ELECTRIC GLASSS CO., LTD.
- 当前专利权人: NIPPON ELECTRIC GLASSS CO., LTD.
- 当前专利权人地址: JP Shiga
- 优先权: JP 21136408 2021.08.24 JP 22031381 2022.03.02
- 国际申请: PCT/JP2022/029328 2022.07.29
- 进入国家日期: 2024-02-09
- 主分类号: C03C3/091
- IPC分类号: C03C3/091 ; C03C4/00 ; H01L21/02 ; H01L23/15
摘要:
A support glass substrate of the present invention is a support glass substrate for supporting a substrate to be processed, the support glass substrate including, as a glass composition, in terms of mol %, 50% to 80% of SiO2, 0% to 25% of Al2O3, 5.5% to 20% of B2O3, 0% to 5% of Li2O+Na2O+K2O, 0% to 15% of MgO, 1% to 25% of CaO, 0% to 10% of SrO, and 0% to 10% of BaO, having a molar ratio (MgO+SrO+BaO)/CaO of 1.5 or less, and having an average coefficient of thermal expansion at from 30° C. to 380° C. of from 35×10−7/° C. to 60×10−7/° C.
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