- 专利标题: METHOD OF SOLVENT-FREE MANUFACTURING OF COMPOSITE ELECTRODES INCORPORATING RADIATION CURABLE BINDERS
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申请号: US18647040申请日: 2024-04-26
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公开(公告)号: US20240355997A1公开(公告)日: 2024-10-24
- 发明人: ZHIJIA DU , CHRISTOPHER JAMES JANKE , JIANLIN LI , DAVID L. WOOD, III , CLAUS DANIEL
- 申请人: UT-BATTELLE, LLC
- 申请人地址: US TN Oak Ridge
- 专利权人: UT-BATTELLE, LLC
- 当前专利权人: UT-BATTELLE, LLC
- 当前专利权人地址: US TN Oak Ridge
- 主分类号: H01M4/04
- IPC分类号: H01M4/04 ; H01M4/1315 ; H01M4/1391 ; H01M4/13915 ; H01M4/1393 ; H01M4/1397 ; H01M4/62 ; H01M4/02
摘要:
A method of making an electrode includes the step of mixing active material particles, radiation curable resin precursors, and electrically conductive particles to create an electrode precursor mixture. The electrode precursor mixture is electrostatically sprayed onto a current collector to provide an electrode preform. The electrode preform is heated and calendered to melt the resin precursor such that the resin precursor surrounds the active particles and electrically conductive particles. Radiation is applied to the electrode preform sufficient to cure the radiation curable resin precursors into resin.
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