- 专利标题： SENSOR AND FABRICATION METHOD THEREOF
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申请号： US18224786申请日： 2023-07-21
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公开(公告)号： US20240353525A1公开(公告)日： 2024-10-24
- 发明人: Yifan XING , Feng QIN , Baiquan LIN , Xiaonan HAN , Yifan BAO , Ping SU , Shengwei DAI , Zhenyu JIA , Zhen LIU , Xiaojun CHEN
- 申请人： Shanghai Tianma Micro-electronics Co., Ltd.
- 申请人地址： CN Shanghai
- 专利权人： Shanghai Tianma Micro-electronics Co., Ltd.
- 当前专利权人： Shanghai Tianma Micro-electronics Co., Ltd.
- 当前专利权人地址： CN Shanghai
- 优先权： CN 2310438908.X 2023.04.21
- 主分类号： G01S7/03
- IPC分类号： G01S7/03 ; G01S13/02 ; H01P1/18 ; H01P11/00
摘要：
A sensor and its fabrication method are provided. The sensor includes a first glass substrate, a circuit layer on a side of the first glass substrate, and a radio frequency processing chip on a side of the circuit layer away from the first glass substrate.
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