A grid of connection points or surface mount features electrically and/or communicatively couples a first computing component to a second computing component. The grid of connection points include a first connection point type having a first structure and a second connection point type having a second structure. In an example, the first connection point type is a solder ball that is associated with a single signal pin and the second connection point type is a solder bar that is associated with multiple signal pins. One or more of the second connection point types are positioned at and/or around a perimeter of the first computing component, which reduces strain, stress and/or other mechanical forces on the first connection point types and/or on the first computing component and/or the second computing component.