Invention Publication
- Patent Title: THERMAL MANAGEMENT SYSTEM
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Application No.: US18595591Application Date: 2024-03-05
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Publication No.: US20240304901A1Publication Date: 2024-09-12
- Inventor: Tomoaki SUZUKI
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota-shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-shi
- Priority: JP 23036610 2023.03.09
- Main IPC: H01M10/663
- IPC: H01M10/663 ; B60H1/00 ; B60H1/32 ; B60L58/27 ; H01M10/613 ; H01M10/625 ; H01M10/63

Abstract:
A thermal management system includes: a first flow path, a second flow path, a third flow path, and a fourth flow path; an electrical storage device configured to exchange heat with the heat medium in the first flow path; a drive device configured to exchange heat with the heat medium in the second flow path; a radiator located in the third flow path; a chiller device located in the fourth flow path; and a switching device. The switching device is configured to cause a first circuit to be formed when heating for increasing a temperature of the electrical storage device is performed. The first circuit has a first path in which the heat medium circulates through the first flow path and the fourth flow path and a second path in which the heat medium circulates through the second flow path and the third flow path.
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