发明公开
- 专利标题: SEMICONDUCTOR STRUCTURE
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申请号: US18183165申请日: 2023-03-14
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公开(公告)号: US20240274652A1公开(公告)日: 2024-08-15
- 发明人: Wei-Lin Wang , MICHIO SAKURAI , Cheng Yu Tsai , Shou-Zen Chang
- 申请人: Powerchip Semiconductor Manufacturing Corporation
- 申请人地址: TW Hsinchu
- 专利权人: Powerchip Semiconductor Manufacturing Corporation
- 当前专利权人: Powerchip Semiconductor Manufacturing Corporation
- 当前专利权人地址: TW Hsinchu
- 优先权: TW 2105057 2023.02.13
- 主分类号: H01L23/522
- IPC分类号: H01L23/522 ; H01G4/018
摘要:
A semiconductor structure including the following components is provided. A first capacitor structure includes first, second, and third electrode layers and first and second dielectric layers. The second electrode layer is disposed on the first electrode layer. The top-view pattern of the second electrode layer partially overlaps the top-view pattern of the first electrode layer to have a first overlapping region. The third electrode layer is disposed on the second electrode layer. The top-view pattern of the third electrode layer partially overlaps the top-view pattern of the second electrode layer to have a second overlapping region. The first overlapping region and the second overlapping region have the same top-view area. The first dielectric layer is disposed between the first electrode layer and the second electrode layer. The second dielectric layer is disposed between the second electrode layer and the third electrode layer.
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