发明公开
- 专利标题: SEMICONDUCTOR DEVICE
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申请号: US18500993申请日: 2023-11-02
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公开(公告)号: US20240266315A1公开(公告)日: 2024-08-08
- 发明人: Kazuya OKADA
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP 23017514 2023.02.08
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L25/07
摘要:
An object is to provide a technique capable of reducing variations in gate-source voltage among a plurality of semiconductor elements. The semiconductor device includes the plurality of semiconductor elements, a metal electrode, and a control wire. Each of the plurality of semiconductor elements has a control electrode configured to control a main current. The main current of the plurality of semiconductor element flows through the metal electrode. The control wire connects each of the control electrodes of the plurality of semiconductor elements in series, and interlinks with a magnetic field generated when the main current flows through the metal electrode.
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